In this work, a 5 × 5 stacked patch rectangular phased array, along with its feeding network, is designed and fabricated in a multilayered low-temperature co-fired ceramic (LTCC) substrate. The single element of the phased array is a dual linear polarized stacked patch microstrip antenna which has improved impedance as well as 3-dB gain bandwidth due to the stacked patch approach. Based on the field distributions, the single element's orientation is optimized to reduce the mutual couplings between the adjacent elements for a wide beam scanning range over a wide frequency band. The features of multilayered implementation, low dielectric loss, and excellent packaging properties ensure a compact and high-efficiency phased array design and qualify this design as an antenna-in-packaging (AiP) design.
|Title of host publication
|2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI)
|Number of pages
|Published - Dec 4 2021