Ultrastretchable and flexible copper interconnect-based smart patch for adaptive thermotherapy

Aftab M. Hussain, Ernesto B. Lizardo, Galo T. Sevilla, Joanna M. Nassar, Muhammad Mustafa Hussain

Research output: Contribution to journalArticlepeer-review

66 Scopus citations

Abstract

Unprecedented 800% stretchable, non-polymeric, widely used, low-cost, naturally rigid, metallic thin-film copper (Cu)-based flexible and non-invasive, spatially tunable, mobile thermal patch with wireless controllability, adaptability (tunes the amount of heat based on the temperature of the swollen portion), reusability, and affordability due to low-cost complementary metal oxide semiconductor (CMOS) compatible integration. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Original languageEnglish (US)
Pages (from-to)665-673
Number of pages9
JournalAdvanced healthcare materials
Volume4
Issue number5
DOIs
StatePublished - Dec 3 2014

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01
Acknowledged KAUST grant number(s): CRG-1-2012-HUS-008
Acknowledgements: The authors acknowledge the financial support under KAUST Office of Competitive Research Funds CRG-1 Award (CRG-1-2012-HUS-008) for this work. The authors thank KAUST Microfluidics Lab, Prof. Jurgen Kosel and Dr. Ulrich Buttner for the thermal imaging system. The authors appreciate the useful discussions with Dr. Hossain M. Fahad and Dr. Jhonathan P. Rojas. The authors also thank Ms. Caitlin Clark for reviewing the literature of this paper. M.M.H. conceived the idea and directed the experiment. A.M.H. carried out the experiment. E.B.L., G.A.T.S., and J.M.N. provided experimental support. A.M.H. and M.M.H. analyzed the data and wrote the paper. All authors reviewed the paper.

ASJC Scopus subject areas

  • Biomaterials
  • Biomedical Engineering
  • Pharmaceutical Science

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