Abstract
The advantages associated with neuromorphic computation are rich areas of complex research. We address the fabrication challenge of building neuromorphic devices on structurally foldable platform with high integration density. We present a CMOS compatible fabrication process to demonstrate for the first time memristive devices fabricated on bulk monocrystalline silicon (100) which is next transformed into a flexible thin sheet of silicon fabric with all the pre-fabricated devices. This process preserves the ultra-high integration density advantage unachievable on other flexible substrates. In addition, the memristive devices are of the size of a motor neuron and the flexible/folded architectural form factor is critical to match brain cortex's folded pattern for ultra-compact design.
Original language | English (US) |
---|---|
Pages (from-to) | 1392-1395 |
Number of pages | 4 |
Journal | Microelectronics Journal |
Volume | 45 |
Issue number | 11 |
DOIs | |
State | Published - Nov 2014 |
Bibliographical note
KAUST Repository Item: Exported on 2020-10-01ASJC Scopus subject areas
- General Engineering