Toughness amplification in copper/epoxy joints through pulsed laser micro-machined interface heterogeneities

Engineering

• Pulsed Laser 100%
• Surface Heterogeneity 100%
• Laser Micro 100%
• Joints (Structural Components) 100%
• Debonding 50%
• Experimental Result 50%
• Laser Irradiation 50%
• Mechanical Response 50%
• Finite Element Simulation 50%
• Remarkable Increase 50%
• Crack Arrest 50%
• Peel Test 50%
• Cohesive Surface 50%
• Absorbed Energy 50%
• Enhanced Adhesion 50%
• Crack Propagation 50%
• Supports 50%
• Crack Initiation 50%

Keyphrases

• Interface Heterogeneity 100%
• Crack pinning 50%
• Patterned Interfaces 50%
• Cohesive Surface 50%
• Enhanced Adhesion 50%
• Crack Arrest 50%