Toughness amplification in copper/epoxy joints through pulsed laser micro-machined interface heterogeneities

Edwin Hernandez, Marco Alfano, Ditho Pulungan, Gilles Lubineau*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

20 Scopus citations


This work addresses the mechanics of debonding along copper/epoxy joints featuring patterned interfaces. Engineered surface heterogeneities with enhanced adhesion properties are generated through pulsed laser irradiation. Peel tests are carried out to ascertain the effect of patterns shape and area fraction on the mechanical response. Experimental results are evaluated with the support of three-dimensional finite element simulations based on the use of cohesive surfaces. Results discussion is largely framed in terms of effective peel force and energy absorbed to sever the samples. It is shown that surface heterogeneities act as sites of potential crack pinning able to trigger crack initiation, propagation and arrest. Surface patterns ultimately enable a remarkable increase in the effective peel force and dissipated energy with respect to baseline homogeneous sanded interface.

Original languageEnglish (US)
Article number16344
JournalScientific Reports
Issue number1
StatePublished - Dec 1 2017

Bibliographical note

Funding Information:
The research reported in this publication was supported by funding from King Abdullah University of Science and Technology (KAUST). We thank KAUST for its continuous support. M.A. acknowledges the financial support received from University of Calabria.

Publisher Copyright:
© 2017 The Author(s).

ASJC Scopus subject areas

  • General


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