The effect of purge environment on thermal rearrangement of ortho-functional polyamide and polyimide

Huan Wang, Donald R. Paul, Tai-Shung Chung*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

34 Scopus citations

Fingerprint

Dive into the research topics of 'The effect of purge environment on thermal rearrangement of ortho-functional polyamide and polyimide'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemistry