The dependence of accumulative roll bonded copper mechanical properties on grain sub-division, stacking faults, and lattice strains

Engineering

• Strain 100%
• Accumulative Roll 100%
• Grain Subdivision 100%
• Stacking Fault Energy 60%
• X-Ray Diffraction Analysis 40%
• Pure Copper 40%
• Roll Bonding 40%
• Tensiles 20%
• Dislocation Density 20%
• Strain Hardening 20%
• High Resolution Transmission Electron Microscope 20%
• Microstructure Evolution 20%
• Ultimate Tensile Strength 20%
• Strengthening Mechanism 20%
• Room Temperature 20%
• Crystallite Size 20%
• Yield Strength 20%
• Rolled Sample 20%

Material Science

• Stacking Fault 100%
• X Ray Diffraction Analysis 33%
• Crystallite Size 16%
• Yield Stress 16%
• Density 16%
• Ultimate Tensile Strength 16%
• Crystal Structure 16%
• Work Hardening 16%

Keyphrases

• Grain Subdivision 100%
• Tensile Measurements 20%