The 2021 flexible and printed electronics roadmap

Yvan Bonnassieux; Christoph J. Brabec; Yong Cao; Tricia Breen Carmichael; Michael L. Chabinyc; Kwang Ting Cheng; Gyoujin Cho; Anjung Chung; Corie L. Cobb; Andreas Distler; Hans Joachim Egelhaaf; Gerd Grau; Xiaojun Guo; Ghazaleh Haghiashtiani; Tsung Ching Huang; Muhammad Mustafa Hussain; Benjamin Iniguez; Taik Min Lee; Ling Li; Yuguang Ma; Dongge Ma; Michael C. McAlpine; Tse Nga Ng; Ronald Österbacka; Shrayesh N. Patel; Junbiao Peng; Huisheng Peng; Jonathan Rivnay; Leilai Shao; Daniel Steingart; Robert A. Street; Vivek Subramanian; Luisa Torsi; Yunyun Wu

doi:10.1088/2058-8585/abf986

The 2021 flexible and printed electronics roadmap

Yvan Bonnassieux, Christoph J. Brabec, Yong Cao, Tricia Breen Carmichael, Michael L. Chabinyc, Kwang Ting Cheng, Gyoujin Cho, Anjung Chung, Corie L. Cobb, Andreas Distler, Hans Joachim Egelhaaf, Gerd Grau, Xiaojun Guo, Ghazaleh Haghiashtiani, Tsung Ching Huang, Muhammad Mustafa Hussain, Benjamin Iniguez, Taik Min Lee, Ling Li, Yuguang MaDongge Ma, Michael C. McAlpine, Tse Nga Ng, Ronald Österbacka, Shrayesh N. Patel, Junbiao Peng, Huisheng Peng, Jonathan Rivnay, Leilai Shao, Daniel Steingart, Robert A. Street, Vivek Subramanian, Luisa Torsi, Yunyun Wu

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125 Scopus citations

Abstract

This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

Original language	English (US)
Pages (from-to)	023001
Journal	Flexible and Printed Electronics
Volume	6
Issue number	2
DOIs	https://doi.org/10.1088/2058-8585/abf986
State	Published - May 17 2021

Bibliographical note

KAUST Repository Item: Exported on 2021-06-28
Acknowledgements: This material is based, in part, on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5401, as conducted through the flexible hybrid electronics manufacturing innovation institute, NextFlex. The study was also partially supported by a General Research Fund (GRF) grant from Research Grants Council (RGC), Hong Kong (HKUST 16203319).

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10.1088/2058-8585/abf986

https://repository.kaust.edu.sa/bitstream/10754/669780/1/Flexible%20nad%20printed_Bonnassieux_2022_Flex._Print._Electron._6_023001.pdf

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Bonnassieux, Y., Brabec, C. J., Cao, Y., Carmichael, T. B., Chabinyc, M. L., Cheng, K. T., Cho, G., Chung, A., Cobb, C. L., Distler, A., Egelhaaf, H. J., Grau, G., Guo, X., Haghiashtiani, G., Huang, T. C., Hussain, M. M., Iniguez, B., Lee, T. M., Li, L., ... Wu, Y. (2021). The 2021 flexible and printed electronics roadmap. Flexible and Printed Electronics, 6(2), 023001. https://doi.org/10.1088/2058-8585/abf986

@article{e45b17c0091f4a5a9275d5a3d84051cc,

title = "The 2021 flexible and printed electronics roadmap",

abstract = "This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.",

author = "Yvan Bonnassieux and Brabec, {Christoph J.} and Yong Cao and Carmichael, {Tricia Breen} and Chabinyc, {Michael L.} and Cheng, {Kwang Ting} and Gyoujin Cho and Anjung Chung and Cobb, {Corie L.} and Andreas Distler and Egelhaaf, {Hans Joachim} and Gerd Grau and Xiaojun Guo and Ghazaleh Haghiashtiani and Huang, {Tsung Ching} and Hussain, {Muhammad Mustafa} and Benjamin Iniguez and Lee, {Taik Min} and Ling Li and Yuguang Ma and Dongge Ma and McAlpine, {Michael C.} and Ng, {Tse Nga} and Ronald {\"O}sterbacka and Patel, {Shrayesh N.} and Junbiao Peng and Huisheng Peng and Jonathan Rivnay and Leilai Shao and Daniel Steingart and Street, {Robert A.} and Vivek Subramanian and Luisa Torsi and Yunyun Wu",

note = "KAUST Repository Item: Exported on 2021-06-28 Acknowledgements: This material is based, in part, on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5401, as conducted through the flexible hybrid electronics manufacturing innovation institute, NextFlex. The study was also partially supported by a General Research Fund (GRF) grant from Research Grants Council (RGC), Hong Kong (HKUST 16203319).",

year = "2021",

month = may,

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doi = "10.1088/2058-8585/abf986",

language = "English (US)",

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Bonnassieux, Y, Brabec, CJ, Cao, Y, Carmichael, TB, Chabinyc, ML, Cheng, KT, Cho, G, Chung, A, Cobb, CL, Distler, A, Egelhaaf, HJ, Grau, G, Guo, X, Haghiashtiani, G, Huang, TC, Hussain, MM, Iniguez, B, Lee, TM, Li, L, Ma, Y, Ma, D, McAlpine, MC, Ng, TN, Österbacka, R, Patel, SN, Peng, J, Peng, H, Rivnay, J, Shao, L, Steingart, D, Street, RA, Subramanian, V, Torsi, L & Wu, Y 2021, 'The 2021 flexible and printed electronics roadmap', Flexible and Printed Electronics, vol. 6, no. 2, pp. 023001. https://doi.org/10.1088/2058-8585/abf986

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AU - Bonnassieux, Yvan

AU - Brabec, Christoph J.

AU - Cao, Yong

AU - Carmichael, Tricia Breen

AU - Chabinyc, Michael L.

AU - Cheng, Kwang Ting

AU - Cho, Gyoujin

AU - Chung, Anjung

AU - Cobb, Corie L.

AU - Distler, Andreas

AU - Egelhaaf, Hans Joachim

AU - Grau, Gerd

AU - Guo, Xiaojun

AU - Haghiashtiani, Ghazaleh

AU - Huang, Tsung Ching

AU - Hussain, Muhammad Mustafa

AU - Iniguez, Benjamin

AU - Lee, Taik Min

AU - Li, Ling

AU - Ma, Yuguang

AU - Ma, Dongge

AU - McAlpine, Michael C.

AU - Ng, Tse Nga

AU - Österbacka, Ronald

AU - Patel, Shrayesh N.

AU - Peng, Junbiao

AU - Peng, Huisheng

AU - Rivnay, Jonathan

AU - Shao, Leilai

AU - Steingart, Daniel

AU - Street, Robert A.

AU - Subramanian, Vivek

AU - Torsi, Luisa

AU - Wu, Yunyun

N1 - KAUST Repository Item: Exported on 2021-06-28 Acknowledgements: This material is based, in part, on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5401, as conducted through the flexible hybrid electronics manufacturing innovation institute, NextFlex. The study was also partially supported by a General Research Fund (GRF) grant from Research Grants Council (RGC), Hong Kong (HKUST 16203319).

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AB - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

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SP - 023001

JO - Flexible and Printed Electronics

JF - Flexible and Printed Electronics

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The 2021 flexible and printed electronics roadmap

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