TDDB Reliability Improvement of Cu Damascene with a Bilayer-Structured α-SiC:H Dielectric Barrier

Chiu Chih Chiang^*, Mao Chieh Chen, Zhen Cheng Wu, Lain Jong Li, Syun Ming Jang, Chen Hua Yu, Mong Song Liang

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review