Surface Photon-Engineered Infrared-Black Metametal Enabled Enhancement of Heat Dissipation

Yanpei Tian, Xiaojie Liu, Lijia Xie, Shilin Xu, Fangqi Chen, Ying Mu, Yang Liu, Marilyn L. Minus, Yi Zheng

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


Heat dissipation is a severe barrier for ever-smaller and more functionalized electronics, necessitating the continuous development of accessible, cost-effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (
Original languageEnglish (US)
JournalAdvanced Functional Materials
Issue number46
StatePublished - Nov 10 2022
Externally publishedYes

Bibliographical note

Generated from Scopus record by KAUST IRTS on 2023-09-23

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Electronic, Optical and Magnetic Materials


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