Surface Photon-Engineered Infrared-Black Metametal Enabled Enhancement of Heat Dissipation

Yanpei Tian; Xiaojie Liu; Lijia Xie; Shilin Xu; Fangqi Chen; Ying Mu; Yang Liu; Marilyn L. Minus; Yi Zheng

doi:10.1002/adfm.202205016

Surface Photon-Engineered Infrared-Black Metametal Enabled Enhancement of Heat Dissipation

Yanpei Tian, Xiaojie Liu, Lijia Xie, Shilin Xu, Fangqi Chen, Ying Mu, Yang Liu, Marilyn L. Minus, Yi Zheng

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

Heat dissipation is a severe barrier for ever-smaller and more functionalized electronics, necessitating the continuous development of accessible, cost-effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (

Original language	English (US)
Journal	Advanced Functional Materials
Volume	32
Issue number	46
DOIs	https://doi.org/10.1002/adfm.202205016
State	Published - Nov 10 2022
Externally published	Yes

Bibliographical note

Generated from Scopus record by KAUST IRTS on 2023-09-23

ASJC Scopus subject areas

General Chemical Engineering
Electronic, Optical and Magnetic Materials

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10.1002/adfm.202205016

Cite this

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abstract = "Heat dissipation is a severe barrier for ever-smaller and more functionalized electronics, necessitating the continuous development of accessible, cost-effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (",

author = "Yanpei Tian and Xiaojie Liu and Lijia Xie and Shilin Xu and Fangqi Chen and Ying Mu and Yang Liu and Minus, {Marilyn L.} and Yi Zheng",

note = "Generated from Scopus record by KAUST IRTS on 2023-09-23",

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T1 - Surface Photon-Engineered Infrared-Black Metametal Enabled Enhancement of Heat Dissipation

AU - Tian, Yanpei

AU - Liu, Xiaojie

AU - Xie, Lijia

AU - Xu, Shilin

AU - Chen, Fangqi

AU - Mu, Ying

AU - Liu, Yang

AU - Minus, Marilyn L.

AU - Zheng, Yi

N1 - Generated from Scopus record by KAUST IRTS on 2023-09-23

PY - 2022/11/10

Y1 - 2022/11/10

N2 - Heat dissipation is a severe barrier for ever-smaller and more functionalized electronics, necessitating the continuous development of accessible, cost-effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (

AB - Heat dissipation is a severe barrier for ever-smaller and more functionalized electronics, necessitating the continuous development of accessible, cost-effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (

UR - https://onlinelibrary.wiley.com/doi/10.1002/adfm.202205016

UR - http://www.scopus.com/inward/record.url?scp=85137331162&partnerID=8YFLogxK

U2 - 10.1002/adfm.202205016

DO - 10.1002/adfm.202205016

M3 - Article

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VL - 32

JO - Advanced Functional Materials

JF - Advanced Functional Materials

IS - 46

ER -

Surface Photon-Engineered Infrared-Black Metametal Enabled Enhancement of Heat Dissipation

Abstract

Bibliographical note

ASJC Scopus subject areas

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