TY - JOUR
T1 - Sub-15-nm patterning of asymmetric metal electrodes and devices by adhesion lithography
AU - Beesley, David J.
AU - Semple, James
AU - Jagadamma, Lethy Krishnan
AU - Amassian, Aram
AU - McLachlan, Martyn A.
AU - Anthopoulos, Thomas D.
AU - deMello, John C.
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2014/5/27
Y1 - 2014/5/27
N2 - Coplanar electrodes formed from asymmetric metals separated on the nanometre length scale are essential elements of nanoscale photonic and electronic devices. Existing fabrication methods typically involve electron-beam lithography - a technique that enables high fidelity patterning but suffers from significant limitations in terms of low throughput, poor scalability to large areas and restrictive choice of substrate and electrode materials. Here, we describe a versatile method for the rapid fabrication of asymmetric nanogap electrodes that exploits the ability of selected self-assembled monolayers to attach conformally to a prepatterned metal layer and thereby weaken adhesion to a subsequently deposited metal film. The method may be carried out under ambient conditions using simple equipment and a minimum of processing steps, enabling the rapid fabrication of nanogap electrodes and optoelectronic devices with aspect ratios in excess of 100,000.2014 Macmillan Publishers Limited. All rights reserved.
AB - Coplanar electrodes formed from asymmetric metals separated on the nanometre length scale are essential elements of nanoscale photonic and electronic devices. Existing fabrication methods typically involve electron-beam lithography - a technique that enables high fidelity patterning but suffers from significant limitations in terms of low throughput, poor scalability to large areas and restrictive choice of substrate and electrode materials. Here, we describe a versatile method for the rapid fabrication of asymmetric nanogap electrodes that exploits the ability of selected self-assembled monolayers to attach conformally to a prepatterned metal layer and thereby weaken adhesion to a subsequently deposited metal film. The method may be carried out under ambient conditions using simple equipment and a minimum of processing steps, enabling the rapid fabrication of nanogap electrodes and optoelectronic devices with aspect ratios in excess of 100,000.2014 Macmillan Publishers Limited. All rights reserved.
UR - http://hdl.handle.net/10754/325313
UR - http://www.nature.com/articles/ncomms4933
UR - http://www.scopus.com/inward/record.url?scp=84901502703&partnerID=8YFLogxK
U2 - 10.1038/ncomms4933
DO - 10.1038/ncomms4933
M3 - Article
C2 - 24861953
SN - 2041-1723
VL - 5
JO - Nature Communications
JF - Nature Communications
IS - 1
ER -