TY - GEN
T1 - Structural and morphological properties of HfxZr 1-xO2 thin films prepared by Pechini route
AU - García-Cerda, L. A.
AU - Puente-Urbina, B. A.
AU - Quevedo-López, Manuel Angel Quevedo
AU - Gnade, Bruce E.
AU - Baldenegro-Pérez, Leonardo Aurelio
AU - Alshareef, Husam N.
AU - Hernández-Landaverde, Martín Adelaido
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2010/3
Y1 - 2010/3
N2 - In this study, HfxZr1-xO2 (0 < x < 1) thin films were deposited on silicon wafers using a dip-coating technique and by using a precursor solution prepared by the Pechini route. The effects of annealing temperature on the structure and morphological properties of the proposed films were investigated. HfxZr1-xO2 thin films with 1, 3 and 5 layers were annealed in air for 2 h at 600 and 800 °C and the structural and morphological properties studied by X-ray diffraction (XRD) and scanning electron microscopy (SEM). XRD results show that the films have monoclinic and tetragonal structure depending of the Hf and Zr concentration. SEM photographs show that all films consist of nanocrystalline grains with sizes in the range of 6 - 13 nm. The total film thickness is about 90 nm. © (2010) Trans Tech Publications.
AB - In this study, HfxZr1-xO2 (0 < x < 1) thin films were deposited on silicon wafers using a dip-coating technique and by using a precursor solution prepared by the Pechini route. The effects of annealing temperature on the structure and morphological properties of the proposed films were investigated. HfxZr1-xO2 thin films with 1, 3 and 5 layers were annealed in air for 2 h at 600 and 800 °C and the structural and morphological properties studied by X-ray diffraction (XRD) and scanning electron microscopy (SEM). XRD results show that the films have monoclinic and tetragonal structure depending of the Hf and Zr concentration. SEM photographs show that all films consist of nanocrystalline grains with sizes in the range of 6 - 13 nm. The total film thickness is about 90 nm. © (2010) Trans Tech Publications.
UR - http://hdl.handle.net/10754/564273
UR - https://www.scientific.net/MSF.644.113
UR - http://www.scopus.com/inward/record.url?scp=77950999289&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.644.113
DO - 10.4028/www.scientific.net/MSF.644.113
M3 - Conference contribution
SN - 087849281X; 9780878492817
SP - 113
EP - 116
BT - Materials Science Forum
PB - Trans Tech Publications
ER -