Stretchable and foldable silicon-based electronics

Adrian Cavazos Sepulveda, M. S. Diaz Cordero, Armando Arpys Arevalo Carreno, Joanna M. Nassar, Muhammad Mustafa Hussain

Research output: Contribution to journalArticlepeer-review

19 Scopus citations


Flexible and stretchable semiconducting substrates provide the foundation for novel electronic applications. Usually, ultra-thin, flexible but often fragile substrates are used in such applications. Here, we describe flexible, stretchable, and foldable 500-μm-thick bulk mono-crystalline silicon (100) “islands” that are interconnected via extremely compliant 30-μm-thick connectors made of silicon. The thick mono-crystalline segments create a stand-alone silicon array that is capable of bending to a radius of 130 μm. The bending radius of the array does not depend on the overall substrate thickness because the ultra-flexible silicon connectors are patterned. We use fracture propagation to release the islands. Because they allow for three-dimensional monolithic stacking of integrated circuits or other electronics without any through-silicon vias, our mono-crystalline islands can be used as a “more-than-Moore” strategy and to develop wearable electronics that are sufficiently robust to be compatible with flip-chip bonding.
Original languageEnglish (US)
Pages (from-to)134103
JournalApplied Physics Letters
Issue number13
StatePublished - Mar 30 2017

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: The research reported in this publication was supported by the King Abdullah University of Science and Technology (KAUST). We also thank Virginia A. Unkefer for helping with the literature.


Dive into the research topics of 'Stretchable and foldable silicon-based electronics'. Together they form a unique fingerprint.

Cite this