Strategies for optimal chemical mechanical polishing (CMP) slurry design

Engineering

• Chemical Mechanical Polishing 100%
• Performance 50%
• Microelectronics 33%
• Polishing Slurry 33%
• Silicon Dioxide 33%
• Optimization 16%
• Operational Parameter 16%
• Material Removal Rate 16%
• Removal Rate 16%
• Surface Defect 16%
• Forming Surface 16%
• Atomic Layer 16%
• Molecular Level 16%
• Modified Film 16%
• Defectivity 16%
• Slurry Stability 16%
• Slurry Particle 16%
• Global Planarization 16%
• Gas Fuel Manufacture 16%
• Models 16%
• Surfaces 16%
• Design 16%
• Development 16%
• Mechanisms 16%
• Substrates 16%

Material Science

• Slurry 33%
• Solution Chemistry 16%
• Surface Defect 16%
• Liquid Films 16%
• Surface 16%
• Devices 16%
• Particle 16%