Solid state MEMS devices on flexible and semi-transparent silicon (100) platform

Sally Ahmed; Aftab M. Hussain; Jhonathan Prieto Rojas; Muhammad Mustafa Hussain

doi:10.1109/MEMSYS.2014.6765699

Solid state MEMS devices on flexible and semi-transparent silicon (100) platform

Sally Ahmed, Aftab M. Hussain, Jhonathan Prieto Rojas, Muhammad Mustafa Hussain

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

13 Scopus citations

Abstract

We report fabrication of MEMS thermal actuators on flexible and semi-transparent silicon fabric released from bulk silicon (100). We fabricated the devices first and then released the top portion of the silicon (≈ 19 μm) which is flexible and semi-transparent. We also performed chemical mechanical polishing to reuse the remaining wafer. A tested thermal actuator with 3 μm wide 240 μm hot arm and 10 μm wide 185 μm long cold arm deflected by 1.7 μm at 1 V. The fabricated thermal actuators exhibit similar performance before and after bending. We believe the demonstrated process will expand the horizon of flexible electronics into MEMS world devices. © 2014 IEEE.

Original language	English (US)
Title of host publication	2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	548-551
Number of pages	4
ISBN (Print)	9781479935086
DOIs	https://doi.org/10.1109/MEMSYS.2014.6765699
State	Published - Jan 2014

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KAUST Repository Item: Exported on 2020-10-01

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10.1109/MEMSYS.2014.6765699

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@inproceedings{983745ac02fa43879bab2914387fc94d,

title = "Solid state MEMS devices on flexible and semi-transparent silicon (100) platform",

abstract = "We report fabrication of MEMS thermal actuators on flexible and semi-transparent silicon fabric released from bulk silicon (100). We fabricated the devices first and then released the top portion of the silicon (≈ 19 μm) which is flexible and semi-transparent. We also performed chemical mechanical polishing to reuse the remaining wafer. A tested thermal actuator with 3 μm wide 240 μm hot arm and 10 μm wide 185 μm long cold arm deflected by 1.7 μm at 1 V. The fabricated thermal actuators exhibit similar performance before and after bending. We believe the demonstrated process will expand the horizon of flexible electronics into MEMS world devices. {\textcopyright} 2014 IEEE.",

author = "Sally Ahmed and Hussain, {Aftab M.} and Rojas, {Jhonathan Prieto} and Hussain, {Muhammad Mustafa}",

note = "KAUST Repository Item: Exported on 2020-10-01",

year = "2014",

month = jan,

doi = "10.1109/MEMSYS.2014.6765699",

language = "English (US)",

isbn = "9781479935086",

pages = "548--551",

booktitle = "2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)",

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}

Solid state MEMS devices on flexible and semi-transparent silicon (100) platform. / Ahmed, Sally; Hussain, Aftab M.; Rojas, Jhonathan Prieto et al.
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS). Institute of Electrical and Electronics Engineers (IEEE), 2014. p. 548-551.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Solid state MEMS devices on flexible and semi-transparent silicon (100) platform

AU - Ahmed, Sally

AU - Hussain, Aftab M.

AU - Rojas, Jhonathan Prieto

AU - Hussain, Muhammad Mustafa

N1 - KAUST Repository Item: Exported on 2020-10-01

PY - 2014/1

Y1 - 2014/1

N2 - We report fabrication of MEMS thermal actuators on flexible and semi-transparent silicon fabric released from bulk silicon (100). We fabricated the devices first and then released the top portion of the silicon (≈ 19 μm) which is flexible and semi-transparent. We also performed chemical mechanical polishing to reuse the remaining wafer. A tested thermal actuator with 3 μm wide 240 μm hot arm and 10 μm wide 185 μm long cold arm deflected by 1.7 μm at 1 V. The fabricated thermal actuators exhibit similar performance before and after bending. We believe the demonstrated process will expand the horizon of flexible electronics into MEMS world devices. © 2014 IEEE.

AB - We report fabrication of MEMS thermal actuators on flexible and semi-transparent silicon fabric released from bulk silicon (100). We fabricated the devices first and then released the top portion of the silicon (≈ 19 μm) which is flexible and semi-transparent. We also performed chemical mechanical polishing to reuse the remaining wafer. A tested thermal actuator with 3 μm wide 240 μm hot arm and 10 μm wide 185 μm long cold arm deflected by 1.7 μm at 1 V. The fabricated thermal actuators exhibit similar performance before and after bending. We believe the demonstrated process will expand the horizon of flexible electronics into MEMS world devices. © 2014 IEEE.

UR - http://hdl.handle.net/10754/564872

UR - http://ieeexplore.ieee.org/document/6765699/

UR - http://www.scopus.com/inward/record.url?scp=84898985471&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2014.6765699

DO - 10.1109/MEMSYS.2014.6765699

M3 - Conference contribution

SN - 9781479935086

SP - 548

EP - 551

BT - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

PB - Institute of Electrical and Electronics Engineers (IEEE)

ER -

Solid state MEMS devices on flexible and semi-transparent silicon (100) platform

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