SIW based multilayer transition and power divider in LTCC technology

Hattan Abuzaid; Ali Doghri; Ke Wu; Atif Shamim

doi:10.1109/MWSYM.2013.6697791

SIW based multilayer transition and power divider in LTCC technology

Hattan Abuzaid, Ali Doghri, Ke Wu, Atif Shamim

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

10 Scopus citations

Abstract

A multilayer transition and balanced power divider are presented for millimeter-wave system-on-package (SoP). These two components operate at Ka-band and exploit the substrate integrate waveguide (SIW) technology with its shielding characteristics and the Low-temperature co-fired ceramics (LTCC) technology for its high density integration. A coupling slot has been used to perform vertical integration, which can be easily optimized through its length. The measured input return loss within the bandwidth of interest (32 GHz-38 GHz) is less than -15 dB and -18 dB for the multilayer transition and the power divider, respectively. The lateral dimensions of a multilayer system, such as a feed network of an array, can be greatly reduced by employing these 3D slot-coupled components. © 2013 IEEE.

Original language	English (US)
Title of host publication	2013 IEEE MTT-S International Microwave Symposium Digest (MTT)
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
ISBN (Print)	9781467361767
DOIs	https://doi.org/10.1109/MWSYM.2013.6697791
State	Published - Jun 2013

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KAUST Repository Item: Exported on 2020-10-01

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10.1109/MWSYM.2013.6697791

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@inproceedings{4a4e844c262249b19d0caf3064237dfd,

title = "SIW based multilayer transition and power divider in LTCC technology",

abstract = "A multilayer transition and balanced power divider are presented for millimeter-wave system-on-package (SoP). These two components operate at Ka-band and exploit the substrate integrate waveguide (SIW) technology with its shielding characteristics and the Low-temperature co-fired ceramics (LTCC) technology for its high density integration. A coupling slot has been used to perform vertical integration, which can be easily optimized through its length. The measured input return loss within the bandwidth of interest (32 GHz-38 GHz) is less than -15 dB and -18 dB for the multilayer transition and the power divider, respectively. The lateral dimensions of a multilayer system, such as a feed network of an array, can be greatly reduced by employing these 3D slot-coupled components. {\textcopyright} 2013 IEEE.",

author = "Hattan Abuzaid and Ali Doghri and Ke Wu and Atif Shamim",

note = "KAUST Repository Item: Exported on 2020-10-01",

year = "2013",

month = jun,

doi = "10.1109/MWSYM.2013.6697791",

language = "English (US)",

isbn = "9781467361767",

booktitle = "2013 IEEE MTT-S International Microwave Symposium Digest (MTT)",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

}

TY - GEN

T1 - SIW based multilayer transition and power divider in LTCC technology

AU - Abuzaid, Hattan

AU - Doghri, Ali

AU - Wu, Ke

AU - Shamim, Atif

N1 - KAUST Repository Item: Exported on 2020-10-01

PY - 2013/6

Y1 - 2013/6

N2 - A multilayer transition and balanced power divider are presented for millimeter-wave system-on-package (SoP). These two components operate at Ka-band and exploit the substrate integrate waveguide (SIW) technology with its shielding characteristics and the Low-temperature co-fired ceramics (LTCC) technology for its high density integration. A coupling slot has been used to perform vertical integration, which can be easily optimized through its length. The measured input return loss within the bandwidth of interest (32 GHz-38 GHz) is less than -15 dB and -18 dB for the multilayer transition and the power divider, respectively. The lateral dimensions of a multilayer system, such as a feed network of an array, can be greatly reduced by employing these 3D slot-coupled components. © 2013 IEEE.

AB - A multilayer transition and balanced power divider are presented for millimeter-wave system-on-package (SoP). These two components operate at Ka-band and exploit the substrate integrate waveguide (SIW) technology with its shielding characteristics and the Low-temperature co-fired ceramics (LTCC) technology for its high density integration. A coupling slot has been used to perform vertical integration, which can be easily optimized through its length. The measured input return loss within the bandwidth of interest (32 GHz-38 GHz) is less than -15 dB and -18 dB for the multilayer transition and the power divider, respectively. The lateral dimensions of a multilayer system, such as a feed network of an array, can be greatly reduced by employing these 3D slot-coupled components. © 2013 IEEE.

UR - http://hdl.handle.net/10754/564754

UR - http://ieeexplore.ieee.org/document/6697791/

UR - http://www.scopus.com/inward/record.url?scp=84893228259&partnerID=8YFLogxK

U2 - 10.1109/MWSYM.2013.6697791

DO - 10.1109/MWSYM.2013.6697791

M3 - Conference contribution

SN - 9781467361767

BT - 2013 IEEE MTT-S International Microwave Symposium Digest (MTT)

PB - Institute of Electrical and Electronics Engineers (IEEE)

ER -

SIW based multilayer transition and power divider in LTCC technology

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