Room-temperature soldering with nanostructured foils

J. Wang; E. Besnoin; A. Duckham; S. J. Spey; M. E. Reiss; O. M. Knio; M. Powers; M. Whitener; T. P. Weihs

doi:10.1063/1.1623943

Room-temperature soldering with nanostructured foils

J. Wang^*, E. Besnoin, A. Duckham, S. J. Spey, M. E. Reiss, O. M. Knio, M. Powers, M. Whitener, T. P. Weihs

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

215 Scopus citations

Abstract

The exothermic reactions in the nanostructured aluminum (Al)/nickle (Ni) multilayer foils were analyzed. The room-temperature soldering of stainless steel specimens using Al/Ni foils was also studied. X-ray diffraction, differential scanning calorimetry and optical measurements were used to characterize the products, heats and the velocities of the reactions. The results show a tensile shear strength of 48 MPa for the reactive foil joints as compared to 38 MPa for conventional joints.

Original language	English (US)
Pages (from-to)	3987-3989
Number of pages	3
Journal	Applied Physics Letters
Volume	83
Issue number	19
DOIs	https://doi.org/10.1063/1.1623943
State	Published - Nov 10 2003
Externally published	Yes

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.1623943

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title = "Room-temperature soldering with nanostructured foils",

abstract = "The exothermic reactions in the nanostructured aluminum (Al)/nickle (Ni) multilayer foils were analyzed. The room-temperature soldering of stainless steel specimens using Al/Ni foils was also studied. X-ray diffraction, differential scanning calorimetry and optical measurements were used to characterize the products, heats and the velocities of the reactions. The results show a tensile shear strength of 48 MPa for the reactive foil joints as compared to 38 MPa for conventional joints.",

author = "J. Wang and E. Besnoin and A. Duckham and Spey, {S. J.} and Reiss, {M. E.} and Knio, {O. M.} and M. Powers and M. Whitener and Weihs, {T. P.}",

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T1 - Room-temperature soldering with nanostructured foils

AU - Wang, J.

AU - Besnoin, E.

AU - Duckham, A.

AU - Spey, S. J.

AU - Reiss, M. E.

AU - Knio, O. M.

AU - Powers, M.

AU - Whitener, M.

AU - Weihs, T. P.

PY - 2003/11/10

Y1 - 2003/11/10

N2 - The exothermic reactions in the nanostructured aluminum (Al)/nickle (Ni) multilayer foils were analyzed. The room-temperature soldering of stainless steel specimens using Al/Ni foils was also studied. X-ray diffraction, differential scanning calorimetry and optical measurements were used to characterize the products, heats and the velocities of the reactions. The results show a tensile shear strength of 48 MPa for the reactive foil joints as compared to 38 MPa for conventional joints.

AB - The exothermic reactions in the nanostructured aluminum (Al)/nickle (Ni) multilayer foils were analyzed. The room-temperature soldering of stainless steel specimens using Al/Ni foils was also studied. X-ray diffraction, differential scanning calorimetry and optical measurements were used to characterize the products, heats and the velocities of the reactions. The results show a tensile shear strength of 48 MPa for the reactive foil joints as compared to 38 MPa for conventional joints.

UR - http://www.scopus.com/inward/record.url?scp=0344945452&partnerID=8YFLogxK

U2 - 10.1063/1.1623943

DO - 10.1063/1.1623943

M3 - Article

AN - SCOPUS:0344945452

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SP - 3987

EP - 3989

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 19

ER -

Room-temperature soldering with nanostructured foils

Abstract

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