Room temperature soldering of connectors to PCB using reactive multilayer foils

J. Levin*, J. Subramanian, T. Rude, O. Knio, M. Powers, C. Enns

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations


This paper describes a process which uses a multilayered reactive foil to solder gold coated stainless steel connectors to Rogers PCB at room temperature. The technology is based on a reactive foil comprised of thousands of nanoscale layers that alternate between Al and Ni. After being initiated with a small electrical or thermal stimulus, the reactive foil acts as a local heat source, melting solder on either side of the foil and bonding the two components without exposing them to high temperatures. The use of reactive joining allows for the bonding of the connector at any point during the population of the board at room temperature and without flux. The reactive foil also allows for the replacement of Pb-Sn solder, used previously, with Au-Sn solder. This enables the joint to undergo subsequent reflow steps without any degradation in bond strength. We optimized the reactive bond with regards to reactive foil properties and joining pressure. Numerical simulations were used to estimate the thermal exposure of the components during bonding and melting duration of the solder. Results of mechanical and environmental testing of these components are also presented.

Original languageEnglish (US)
Title of host publicationProceedings - 2005 International Symposium on Microelectronics, IMAPS 2005
Number of pages6
StatePublished - 2005
Externally publishedYes
Event38th International Symposium on Microelectronics, IMAPS 2005 - Philadelphia, PA, United States
Duration: Sep 25 2005Sep 29 2005


Other38th International Symposium on Microelectronics, IMAPS 2005
Country/TerritoryUnited States
CityPhiladelphia, PA


  • Connector attach
  • Flux-free
  • Lead-free
  • Room temperature process

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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