Keyphrases
Cl 2
100%
Inductively Coupled Plasma Etching
100%
InSb
100%
Process Optimization
25%
Plasma Power
25%
Surface Morphology
25%
Micromasking
25%
Masking Effect
25%
Power Processes
25%
Gas Composition
25%
Smooth Surface
25%
Ar Plasma
25%
Chuck
25%
Anisotropic Etching
25%
Inductively Coupled Plasma
25%
Process Pressure
25%
Engineering
Room Temperature
100%
Inductively Coupled Plasma
100%
Anisotropic
33%
Masking Effect
33%
Ar Plasma
33%
Process Pressure
33%
Etch Rate
33%
Optimized Process
33%
Smooth Surface
33%
Gas Composition
33%
Surface Morphology
33%
Material Science
Plasma Etching
100%
Surface Morphology
50%
Anisotropic Etching
50%