Recent Progress on Flexible Capacitive Pressure Sensors: From Design and Materials to Applications

Rishabh B. Mishra, Nazek El-Atab, Aftab M. Hussain, Muhammad Mustafa Hussain

Research output: Contribution to journalArticlepeer-review

161 Scopus citations


For decades, the revolution in design and fabrication methodology of flexible capacitive pressure sensors using various inorganic/organic materials has significantly enhanced the field of flexible and wearable electronics with a wide range of applications in aerospace, automobiles, marine environment, robotics, healthcare, and consumer/portable electronics. Mathematical modelling, finite element simulations, and unique fabrication strategies are utilized to fabricate diverse shapes of diaphragms, shells, and cantilevers which function in normal, touch, or double touch modes, operation principles inspired from microelectromechanical systems (MEMS) based capacitive pressure sensing techniques. The capacitive pressure sensing technique detects changes in capacitance due to the deformation/deflection of a pressure sensitive mechanical element that alters the separation gap of the capacitor. Due to advancement in state-of-the-art fabrication technologies, the performance and properties of capacitive pressure sensors are enhanced. In this review paper, recent progress in flexible capacitive pressure sensing techniques in terms of design, materials, and fabrication strategies is reported. The mechanics and fabrication steps of paper-based low-cost MEMS/flexible devices are also broadly reported. Lastly, the applications of flexible capacitive pressure sensors, challenges, and future perspectives are discussed.
Original languageEnglish (US)
Pages (from-to)2001023
JournalAdvanced Materials Technologies
StatePublished - Mar 5 2021

Bibliographical note

KAUST Repository Item: Exported on 2021-03-09
Acknowledgements: The authors acknowledge the generous support of King Abdullah University of Science and Technology (KAUST). The authors thank Kelly Rader for proofreading this manuscript.


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