To alleviate the problems associated with current copper interconnect technology, multi-walled carbon nanotubes (MWCNTs) have been proposed as a potential solution for on-chip communication in VLSI applications. In this paper, we develop an equivalent RC circuit model for MWCNT interconnect that captures both DC conductance and high frequency impedance due to capacitive effects. Based on the circuit model, we find that MWCNT-based interconnect can have substantially less delay than copper wires in global interconnect applications. © 2007 IEEE.
|Original language||English (US)|
|Title of host publication||2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007, Proceedings|
|Number of pages||4|
|State||Published - Dec 1 2007|