TY - GEN
T1 - Provisioning on-chip networks under buffered RC interconnect delay variations
AU - Mondal, Mosin
AU - Ragheb, Tamer
AU - Wu, Xiang
AU - Aziz, Adnan
AU - Massoud, Yehia
N1 - Generated from Scopus record by KAUST IRTS on 2022-09-13
PY - 2007/8/28
Y1 - 2007/8/28
N2 - A Network-on-Chip (NoC) replaces on-chip communication implemented by point-to-point interconnects in a multi-core environment by a set of shared interconnects connected through programmable crosspoints. Since an NoC may provide a number of paths between a given source and destination, manufacturing or runtime faults on one interconnect does not necessarily render the chip useless. It is partly because of this fault tolerance that NoCs have emerged as a viable alternative for implementing communication between functional units of a chip in the nanometer regime, where high defect rates are prevalent. In this paper, we quantify the fault tolerance offered by an NoC against process variations. Specifically, we develop an analytical model for the probability of failure in buffered global NoC links due to interconnect dishing, and effective channel length variation. Using the developed probability model, we study the impact of link failure on the number of cycles required to establish communications in NoC applications. © 2007 IEEE.
AB - A Network-on-Chip (NoC) replaces on-chip communication implemented by point-to-point interconnects in a multi-core environment by a set of shared interconnects connected through programmable crosspoints. Since an NoC may provide a number of paths between a given source and destination, manufacturing or runtime faults on one interconnect does not necessarily render the chip useless. It is partly because of this fault tolerance that NoCs have emerged as a viable alternative for implementing communication between functional units of a chip in the nanometer regime, where high defect rates are prevalent. In this paper, we quantify the fault tolerance offered by an NoC against process variations. Specifically, we develop an analytical model for the probability of failure in buffered global NoC links due to interconnect dishing, and effective channel length variation. Using the developed probability model, we study the impact of link failure on the number of cycles required to establish communications in NoC applications. © 2007 IEEE.
UR - http://ieeexplore.ieee.org/document/4149143/
UR - http://www.scopus.com/inward/record.url?scp=34548133266&partnerID=8YFLogxK
U2 - 10.1109/ISQED.2007.129
DO - 10.1109/ISQED.2007.129
M3 - Conference contribution
SN - 0769527957
SP - 873
EP - 878
BT - Proceedings - Eighth International Symposium on Quality Electronic Design, ISQED 2007
ER -