Preparation of SiO2 on InP substrate by sol-gel technique for integrated optics

J. Liu*, Y. L. Lam, Y. C. Chan, Y. Zhou, B. S. Ooi

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review


In this paper, we report our success in depositing sol-gel derived silica films on InP using multiple spin coating and rapid thermal processing. The effect of rapid thermal process temperature and time duration on the property of the film is studied. The dependence of the single layer thickness as well as its refractive index upon the film preparation parameters have been obtained and are compared with that on silicon substrates. As a result of the study, a crack-free SiO2 film with a thickness of 0.5 μm has been successfully deposited on InP at a processing temperature of 450°C. We believe that our experimental result has indicated that it is possible to fabricate hybridized integrated optics devices on compound semiconductors through the sol-gel route.

Original languageEnglish (US)
Pages (from-to)80-85
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
StatePublished - 1999
Externally publishedYes
EventProceedings of the 1999 Optoelectornic Integrated Circuits and Packaging III - San Jose, CA, USA
Duration: Jan 28 1999Jan 29 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Applied Mathematics
  • Electrical and Electronic Engineering
  • Computer Science Applications


Dive into the research topics of 'Preparation of SiO2 on InP substrate by sol-gel technique for integrated optics'. Together they form a unique fingerprint.

Cite this