Abstract
We present unified predictions for the crack onset strain, evolution of crack density, and changes in electrical resistance in indium tin oxide/polymer thin films under tensile loading. We propose a damage mechanics model to quantify and predict such changes as an alternative to fracture mechanics formulations. Our predictions are obtained by assuming that there are no flaws at the onset of loading as opposed to the assumptions of fracture mechanics approaches. We calibrate the crack onset strain and the damage model based on experimental data reported in the literature. We predict crack density and changes in electrical resistance as a function of the damage induced in the films. We implement our model in the commercial finite element software ABAQUS using a user subroutine UMAT. We obtain fair to good agreement with experiments. © The Author(s) 2014 Reprints and permissions: sagepub.co.uk/journalsPermissions.nav.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 546-561 |
| Number of pages | 16 |
| Journal | International Journal of Damage Mechanics |
| Volume | 24 |
| Issue number | 4 |
| DOIs | |
| State | Published - Jun 11 2014 |
Bibliographical note
KAUST Repository Item: Exported on 2020-10-01Acknowledgements: This work was fully funded by KAUST's research funds. We thank Prof. Gilles Lubineau and Mohamed A. Nasr Saleh from the COHMAS laboratory at KAUST for their support in providing us with microscope images showing crack evolution.