@inproceedings{69a9633a5cd84d6e88ad80d1c35866fa,
title = "Pre-bonding method using self-alignment effect for multichip packaging",
abstract = "An efficient C2C/C2W oxide bonding technique using self-alignment effect of a pair of hydrophilic chip surfaces, which are activated by plasma, is applied to 3D stacking of multichip packaging in this work. Self-alignment and pre-bonding technique can provide high-speed bonding process and high-precision chip alignment accuracy simultaneously without high-precision chip manipulator. Through experiments, we could acquire high hydrophilic silicon surfaces using plasma surface activation and measured position errors and rotational error of aligned chips is smaller than 5μ and 0.04 degrees respectively because of self-alignment effect between hydrophilic surfaces of chips. In addition, temporary bonding is formed successfully by secondary bonding between silanol groups (Si-OH) on the hydrophilic silicon chip surfaces when the DI water is evaporated by heating, which prevents contamination of bonding surface and helps of manipulation of multi-stacked chips easily.",
keywords = "3D stacking, Hydrophilic surface, Multichip packaging, Oxide bonding, Self-alignment",
author = "Lee, {Jae Hak} and Ha, {Tae Ho} and Lee, {Chang Woo} and Song, {Jun Yeob} and Cha, {Min Seok} and Yoo, {Choong Don}",
year = "2009",
doi = "10.1109/ISAM.2009.5376918",
language = "English (US)",
isbn = "9781424446278",
series = "2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009",
pages = "118--123",
booktitle = "2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009",
note = "2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009 ; Conference date: 17-11-2009 Through 20-11-2009",
}