PRACTICAL LIGNIN-BASED ADHESIVE FOR WAFERBOARD/OSB.

L. R. Calve; J. A. Shields; L. Blanchette; J. M.J. Frechet

PRACTICAL LIGNIN-BASED ADHESIVE FOR WAFERBOARD/OSB.

L. R. Calve^*, J. A. Shields, L. Blanchette, J. M.J. Frechet

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

19 Scopus citations

Abstract

An exterior grade adhesive dispersion, based on ammonium spent sulfite liquor (NH//4SSL), an alkaline phenol-formaldehyde (PF) resin, and an acid catalyst was prepared and evaluated for the production of waterboard. Some of the factors affecting its curing properties included the source of NH//4SSL, the lignin to carbohydrate ratio, the molecular weight distribution of PF, and the pH. This resin appears to have considerable potential as a low-cost exterior grade adhesive for waferboard/OSB since NH//4SSL is available at a fraction of the cost of PF. Results indicate that a NH//4SSL-PF resin that contains up to 50 percent solids had curing and adhesive properties similar to commercial PF resins currently used as face resins in the industrial manufacture of 3-layer waferboards.

Original language	English (US)
Pages (from-to)	15-20
Number of pages	6
Journal	Forest Products Journal
Volume	38
Issue number	5
State	Published - May 1988
Externally published	Yes

ASJC Scopus subject areas

Forestry
General Materials Science
Plant Science

Cite this

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title = "PRACTICAL LIGNIN-BASED ADHESIVE FOR WAFERBOARD/OSB.",

abstract = "An exterior grade adhesive dispersion, based on ammonium spent sulfite liquor (NH//4SSL), an alkaline phenol-formaldehyde (PF) resin, and an acid catalyst was prepared and evaluated for the production of waterboard. Some of the factors affecting its curing properties included the source of NH//4SSL, the lignin to carbohydrate ratio, the molecular weight distribution of PF, and the pH. This resin appears to have considerable potential as a low-cost exterior grade adhesive for waferboard/OSB since NH//4SSL is available at a fraction of the cost of PF. Results indicate that a NH//4SSL-PF resin that contains up to 50 percent solids had curing and adhesive properties similar to commercial PF resins currently used as face resins in the industrial manufacture of 3-layer waferboards.",

author = "Calve, {L. R.} and Shields, {J. A.} and L. Blanchette and Frechet, {J. M.J.}",

year = "1988",

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AU - Calve, L. R.

AU - Shields, J. A.

AU - Blanchette, L.

AU - Frechet, J. M.J.

PY - 1988/5

Y1 - 1988/5

N2 - An exterior grade adhesive dispersion, based on ammonium spent sulfite liquor (NH//4SSL), an alkaline phenol-formaldehyde (PF) resin, and an acid catalyst was prepared and evaluated for the production of waterboard. Some of the factors affecting its curing properties included the source of NH//4SSL, the lignin to carbohydrate ratio, the molecular weight distribution of PF, and the pH. This resin appears to have considerable potential as a low-cost exterior grade adhesive for waferboard/OSB since NH//4SSL is available at a fraction of the cost of PF. Results indicate that a NH//4SSL-PF resin that contains up to 50 percent solids had curing and adhesive properties similar to commercial PF resins currently used as face resins in the industrial manufacture of 3-layer waferboards.

AB - An exterior grade adhesive dispersion, based on ammonium spent sulfite liquor (NH//4SSL), an alkaline phenol-formaldehyde (PF) resin, and an acid catalyst was prepared and evaluated for the production of waterboard. Some of the factors affecting its curing properties included the source of NH//4SSL, the lignin to carbohydrate ratio, the molecular weight distribution of PF, and the pH. This resin appears to have considerable potential as a low-cost exterior grade adhesive for waferboard/OSB since NH//4SSL is available at a fraction of the cost of PF. Results indicate that a NH//4SSL-PF resin that contains up to 50 percent solids had curing and adhesive properties similar to commercial PF resins currently used as face resins in the industrial manufacture of 3-layer waferboards.

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M3 - Article

AN - SCOPUS:0024012806

SN - 0015-7473

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SP - 15

EP - 20

JO - Forest Products Journal

JF - Forest Products Journal

IS - 5

ER -

PRACTICAL LIGNIN-BASED ADHESIVE FOR WAFERBOARD/OSB.

Abstract

ASJC Scopus subject areas

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