Abstract
This research paper presents a study of boiling heat transfer from longitudinal rectangular-finned surfaces immersed in saturated water at low vapor pressures. Finned surfaces with assorted fin spacing, fin thicknesses, and fin heights on a copper based surface have been investigated. All the finned surfaces were found to increase both boiling heat transfer coefficients and critical heat fluxes. An optimal fin thickness was found for a configuration, and heat transfer coefficients have been obtained at the pressures. Factors affecting the boiling characteristics have been identified and the optimal enhancement requires a balance of the active nucleation sites, bubble flow resistance, natural convection, thin film evaporation, liquid superheating, heat transfer area, bubble coalescence, and liquid reflux resistance. High speed visualization of vapor plug and vapor film generation on the boiling surfaces has revealed significant insights into the boiling mechanisms at low saturation pressures.
Original language | English (US) |
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Pages (from-to) | 1-6 |
Number of pages | 6 |
Journal | Journal of Heat Transfer |
Volume | 132 |
Issue number | 3 |
DOIs | |
State | Published - Mar 2010 |
Externally published | Yes |
Keywords
- Boiling
- Boiling enhancement
- Bubble visualization
- Electronic cooling
- Extended surfaces
- Subatmospheric pressure
- Thermosyphon
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering