Plasma-induced damage in high-formula formula-κ/metal gate stack dry etch

Plasma-based dry etch is used as the industry standard gate etch in conventional CMOS fabrication flow. However, past studies indicate that plasma-induced dry etch may impact device performance. The current research trend toward replacing conventional silicon dioxide and polysilicon gate stacks with high-k/metal gate stacks introduces a new challenge: development of new dry etch processes for critical new metals and their alloys. In this letter, a comparative study in the context of device performance has been conducted to compare dry etch versus wet etch for gate stack etch of hafnium oxide/tantalum silicon nitride gate stack. It has been found that the dry-etched gate stack exhibit significantly more gate leakage current and poorer uniformity in threshold-voltage distribution.