TY - GEN
T1 - Plane-view transmission electron microscopy for advanced integrated circuit
AU - Liu, Pan
AU - Li, K.
AU - Er, Eddie
AU - Zhao, Siping
PY - 2006
Y1 - 2006
N2 - In this paper, the authors try to introduce three techniques for plane-view TEM sample preparation. First, traditional plane-view TEM sample preparation will be introduced. The second technique is FIB-based lift-out method, which places the sample on the carbon film. This technique is used to cut isolated defects, such as SRAM single bit failure, but this technique introduces artifacts from FIB ion damage and carbon film. The last technique is a combination of tripod polishing, FIB milling and ion milling. Specific cases will be given to illustrate the application of these techniques.
AB - In this paper, the authors try to introduce three techniques for plane-view TEM sample preparation. First, traditional plane-view TEM sample preparation will be introduced. The second technique is FIB-based lift-out method, which places the sample on the carbon film. This technique is used to cut isolated defects, such as SRAM single bit failure, but this technique introduces artifacts from FIB ion damage and carbon film. The last technique is a combination of tripod polishing, FIB milling and ion milling. Specific cases will be given to illustrate the application of these techniques.
UR - http://www.scopus.com/inward/record.url?scp=35148845671&partnerID=8YFLogxK
U2 - 10.1109/SMELEC.2006.380709
DO - 10.1109/SMELEC.2006.380709
M3 - Conference contribution
AN - SCOPUS:35148845671
SN - 0780397312
SN - 9780780397316
T3 - IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
SP - 630
EP - 633
BT - ICSE 2006
T2 - 2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006
Y2 - 29 November 2006 through 1 December 2006
ER -