TY - GEN
T1 - Out-of-plane platforms with bi-directional thermal bimorph actuation for transducer applications
AU - Conchouso Gonzalez, David
AU - Carreno, Armando Arpys Arevalo
AU - Castro, D.
AU - Foulds, Ian G.
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2015/4
Y1 - 2015/4
N2 - This paper reports on the Buckled Cantilever Platform (BCP) that allows the manipulation of the out of plane structures through the adjustment of the pitch angle using thermal bimorph micro-Actuators. Due to the micro-fabrication process used, the bimorph actuators can be designed to move in both: Counter Clockwise (CCW) and Clockwise (CW) directions with a resolution of up to 110 μm/V, with smallest step in the range of nanometers. Thermal and electrical characterization of the thermal bimorph actuators showed low influence in the platforms temperature and low power consumption (< 35μW) mainly due to the natural isolation of the structure. Tip displacements larger than 500μm were achieved. The precise angle adjustment achieved through these mechanisms makes them optimal for a range of different MEMS applications, like optical benches and low frequency sweeping sensors and antennas. © 2015 IEEE.
AB - This paper reports on the Buckled Cantilever Platform (BCP) that allows the manipulation of the out of plane structures through the adjustment of the pitch angle using thermal bimorph micro-Actuators. Due to the micro-fabrication process used, the bimorph actuators can be designed to move in both: Counter Clockwise (CCW) and Clockwise (CW) directions with a resolution of up to 110 μm/V, with smallest step in the range of nanometers. Thermal and electrical characterization of the thermal bimorph actuators showed low influence in the platforms temperature and low power consumption (< 35μW) mainly due to the natural isolation of the structure. Tip displacements larger than 500μm were achieved. The precise angle adjustment achieved through these mechanisms makes them optimal for a range of different MEMS applications, like optical benches and low frequency sweeping sensors and antennas. © 2015 IEEE.
UR - http://hdl.handle.net/10754/577132
UR - http://ieeexplore.ieee.org/document/7147503/
UR - http://www.scopus.com/inward/record.url?scp=84939503421&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2015.7147503
DO - 10.1109/NEMS.2015.7147503
M3 - Conference contribution
SN - 9781467366953
SP - 608
EP - 612
BT - 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -