Abstract
A discontinuous Galerkin time-domain (DGTD) method is proposed in this work to analyze printed circuit board (PCB) power/ground plate-pair having arbitrarily shaped anti-pads. To apply proper excitation source over the irregular anti-pad, the implemented wave port magnetic current excitation is expanded by the electric eigen-modes of the anti-pad that are calculated via either numerical approach or analytical method. Based on the orthogonality of eigen-modes, the temporal mode expansion coefficient for each mode can be conveniently extracted. Besides, considering the presence of decoupling capacitors, the whole physical system can be split into field and circuit subsystems. For the field subsystem, it is governed by the Maxwell's equations, thus it will be solved by DGTD method. For the circuit subsystem, the modified nodal analysis (MNA) is applied. In order to achieve the coupling between the field and circuit subsystems, a lumpled port is defined at the interface between the field and circuit subsystems. To verify the proposed algorithm, several representative examples are benchmarked.
Original language | English (US) |
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Title of host publication | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 1-3 |
Number of pages | 3 |
ISBN (Electronic) | 9781538612385 |
DOIs | |
State | Published - Jul 2 2017 |
Event | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 - Haining, Zhejiang, China Duration: Dec 14 2017 → Dec 16 2017 |
Publication series
Name | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 |
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Volume | 2018-January |
Conference
Conference | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 |
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Country/Territory | China |
City | Haining, Zhejiang |
Period | 12/14/17 → 12/16/17 |
Bibliographical note
Publisher Copyright:© 2017 IEEE.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Instrumentation
- Electrical and Electronic Engineering