Negative bias temperature instability and relaxation in HfSiON gate stack field effect devices

R. A.B. Devine, H. P. Hjalmarson, H. N. Alshareef, M. Quevedo-Lopez

Research output: Contribution to journalArticlepeer-review

Abstract

Negative bias temperature instability and relaxation measurements have been performed on HfSiON gate stack devices. The time exponent for threshold voltage shift evolution is observed to be temperature dependent. The dominant source of the positive charge induced threshold voltage variation is determined to be dielectric trapped charge and this is the source of variation during relaxation. Nonlinear threshold voltage shift versus inversion channel carrier mobility is observed. Its magnitude is inconsistent with expectations from existing models.

Original languageEnglish (US)
Article number153512
JournalApplied Physics Letters
Volume92
Issue number15
DOIs
StatePublished - 2008
Externally publishedYes

Bibliographical note

Funding Information:
This work was partially supported under Air Force Contract No. FA9553-C-0367 and by Sandia Laboratories. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed–Martin Company, for the Unites States Department of Energy’s National Nuclear Security Administration under Contract No. DE-AC04-94AL85000.

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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