Modeling and testing of an advanced compact two-phase cooler for electronics cooling

Mark Aaron Chan; Christopher R. Yap; Kim Choon Ng

doi:10.1016/j.ijheatmasstransfer.2009.02.044

Modeling and testing of an advanced compact two-phase cooler for electronics cooling

Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

14 Scopus citations

Abstract

This paper describes the modeling, design, and testing of a high flux and yet compact two-phase CPU cooler, with excellent attributes of low thermal resistance that are derived from the intrinsic design features of phase change phenomena and minimal vapor pressure drop of the device. For the same footprint of a conventional cooler, the prototype rejects more than twice the capacity of CPUs of today. The unique design minimizes its overall size and yet provides adequate area for forced convection cooling. Testing was conducted over an assorted heat loads and air flow rates flowing through the fins, achieving a best performance of 0.206 K/W of device thermal resistance at a rating of 203 W under an air flow rate of 0.98 m³/min. The prototype device is orientation free where a 90° tilt could perform at the same rating conditions.

Original language	English (US)
Pages (from-to)	3456-3463
Number of pages	8
Journal	International Journal of Heat and Mass Transfer
Volume	52
Issue number	15-16
DOIs	https://doi.org/10.1016/j.ijheatmasstransfer.2009.02.044
State	Published - Jul 2009
Externally published	Yes

Keywords

CPU cooling
Enhanced nucleate boiling
Heat sinks
Porous media

ASJC Scopus subject areas

Condensed Matter Physics
Mechanical Engineering
Fluid Flow and Transfer Processes

Access to Document

10.1016/j.ijheatmasstransfer.2009.02.044

Cite this

@article{d383943c9673452ba5ea8f2866bc634b,

title = "Modeling and testing of an advanced compact two-phase cooler for electronics cooling",

abstract = "This paper describes the modeling, design, and testing of a high flux and yet compact two-phase CPU cooler, with excellent attributes of low thermal resistance that are derived from the intrinsic design features of phase change phenomena and minimal vapor pressure drop of the device. For the same footprint of a conventional cooler, the prototype rejects more than twice the capacity of CPUs of today. The unique design minimizes its overall size and yet provides adequate area for forced convection cooling. Testing was conducted over an assorted heat loads and air flow rates flowing through the fins, achieving a best performance of 0.206 K/W of device thermal resistance at a rating of 203 W under an air flow rate of 0.98 m3/min. The prototype device is orientation free where a 90° tilt could perform at the same rating conditions.",

keywords = "CPU cooling, Enhanced nucleate boiling, Heat sinks, Porous media",

author = "Chan, {Mark Aaron} and Yap, {Christopher R.} and Ng, {Kim Choon}",

year = "2009",

month = jul,

doi = "10.1016/j.ijheatmasstransfer.2009.02.044",

language = "English (US)",

volume = "52",

pages = "3456--3463",

journal = "International Journal of Heat and Mass Transfer",

issn = "0017-9310",

publisher = "Elsevier",

number = "15-16",

}

TY - JOUR

T1 - Modeling and testing of an advanced compact two-phase cooler for electronics cooling

AU - Chan, Mark Aaron

AU - Yap, Christopher R.

AU - Ng, Kim Choon

PY - 2009/7

Y1 - 2009/7

N2 - This paper describes the modeling, design, and testing of a high flux and yet compact two-phase CPU cooler, with excellent attributes of low thermal resistance that are derived from the intrinsic design features of phase change phenomena and minimal vapor pressure drop of the device. For the same footprint of a conventional cooler, the prototype rejects more than twice the capacity of CPUs of today. The unique design minimizes its overall size and yet provides adequate area for forced convection cooling. Testing was conducted over an assorted heat loads and air flow rates flowing through the fins, achieving a best performance of 0.206 K/W of device thermal resistance at a rating of 203 W under an air flow rate of 0.98 m3/min. The prototype device is orientation free where a 90° tilt could perform at the same rating conditions.

AB - This paper describes the modeling, design, and testing of a high flux and yet compact two-phase CPU cooler, with excellent attributes of low thermal resistance that are derived from the intrinsic design features of phase change phenomena and minimal vapor pressure drop of the device. For the same footprint of a conventional cooler, the prototype rejects more than twice the capacity of CPUs of today. The unique design minimizes its overall size and yet provides adequate area for forced convection cooling. Testing was conducted over an assorted heat loads and air flow rates flowing through the fins, achieving a best performance of 0.206 K/W of device thermal resistance at a rating of 203 W under an air flow rate of 0.98 m3/min. The prototype device is orientation free where a 90° tilt could perform at the same rating conditions.

KW - CPU cooling

KW - Enhanced nucleate boiling

KW - Heat sinks

KW - Porous media

UR - http://www.scopus.com/inward/record.url?scp=65549130869&partnerID=8YFLogxK

U2 - 10.1016/j.ijheatmasstransfer.2009.02.044

DO - 10.1016/j.ijheatmasstransfer.2009.02.044

M3 - Article

AN - SCOPUS:65549130869

SN - 0017-9310

VL - 52

SP - 3456

EP - 3463

JO - International Journal of Heat and Mass Transfer

JF - International Journal of Heat and Mass Transfer

IS - 15-16

ER -

Modeling and testing of an advanced compact two-phase cooler for electronics cooling

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this