Modeling and evaluating carbon nanotube bundles for future VLSI interconnect applications

Yehia Massoud, Arthur Nieuwoudt

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations


Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by copper interconnect as process technology scales. In this paper, we develop a scalable equivalent circuit model that captures the statistical distribution of metallic nanotubes, which can impact interconnect reliability, while accurately incorporating recent experimental and theoretical results. Leveraging the circuit model, we examine the performance and reliability of nanotube bundles for both individual signal lines and system-level designs. The results indicate that SWCNT interconnect bundles can provide significant improvement in delay over traditional copper interconnect depending on bundle geometry and process technology. ©2006 IEEE.
Original languageEnglish (US)
Title of host publication2006 1st International Conference on Nano-Networks and Workshops, Nano-Net
StatePublished - Dec 1 2006
Externally publishedYes

Bibliographical note

Generated from Scopus record by KAUST IRTS on 2022-09-13


Dive into the research topics of 'Modeling and evaluating carbon nanotube bundles for future VLSI interconnect applications'. Together they form a unique fingerprint.

Cite this