Abstract
Hyperspectral imaging has emerged as a powerful tool for identifying and remotely sensing complex materials in a wide range of applications, including medical diagnostics, security, food safety, and precision agriculture [1,2]. Despite significant advances in this field, there remain a number of challenges that must be addressed in order to fully realize the potential of hyperspectral imaging in real-world applications. One major challenge is the high cost and slow acquisition time of current state-of-the-art hyperspectral imaging systems, which can exceed 20.000 USD for a single camera and take up to a minute to acquire a single image[3]. Additionally, existing systems are often limited by low spatial resolution and require large amounts of memory storage.
Original language | English (US) |
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Title of host publication | 2023 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2023 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9798350345995 |
DOIs | |
State | Published - 2023 |
Event | 2023 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2023 - Munich, Germany Duration: Jun 26 2023 → Jun 30 2023 |
Publication series
Name | 2023 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2023 |
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Conference
Conference | 2023 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2023 |
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Country/Territory | Germany |
City | Munich |
Period | 06/26/23 → 06/30/23 |
Bibliographical note
Publisher Copyright:© 2023 IEEE.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Instrumentation
- Atomic and Molecular Physics, and Optics