Metallic bonding of ceramic armor using reactive multilayer foils

A. Duckham*, M. Brown, E. Besnoin, D. Van Heerden, O. M. Knio, T. P. Weihs

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

13 Scopus citations


The room temperature brazing and soldering of ceramic armor to metallic plates is described. The novel metallic bonding process uses reactive multilayer foils (NanoFoil™) as local heat sources to melt braze or solder layers placed between the ceramic and metal components. By replacing furnace cycles with local heating this NanoBond™ process eliminates significant heating of the components and thus large area components can be bonded relatively stress-free. Examples of bonding Al 2O 3 to aluminum and of bonding SiC to titanium are presented and several configurations involving different braze and solder layers have been investigated in detail for the bonding of SiC to titanium. Shear strengths have been measured and are found to be significantly higher compared to those measured for similar samples bonded by epoxy adhesives. Numerical predictions of heat flow are also described for the reactive joining process and are validated by IR measurements. Lastly, bond areas over 100 cm 2 are demonstrated.

Original languageEnglish (US)
Pages (from-to)597-603
Number of pages7
JournalCeramic Engineering and Science Proceedings
Issue number3
StatePublished - 2004
Externally publishedYes
Event28th International Conference on Advanced Ceramics and Composites - Cocoa Beach, FL, United States
Duration: Jan 25 2004Jan 30 2004

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry


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