Mechanically flexible optically transparent porous mono-crystalline silicon substrate

Jhonathan Prieto Rojas, Ahad A. Syed, Muhammad Mustafa Hussain

Research output: Chapter in Book/Report/Conference proceedingConference contribution

22 Scopus citations


For the first time, we present a simple process to fabricate a thin (≥5μm), mechanically flexible, optically transparent, porous mono-crystalline silicon substrate. Relying only on reactive ion etching steps, we are able to controllably peel off a thin layer of the original substrate. This scheme is cost favorable as it uses a low-cost silicon wafer and furthermore it has the potential for recycling the remaining part of the wafer that otherwise would be lost and wasted during conventional back-grinding process. Due to its porosity, it shows see-through transparency and potential for flexible membrane applications, neural probing and such. Our process can offer flexible, transparent silicon from post high-thermal budget processed device wafer to retain the high performance electronics on flexible substrates. © 2012 IEEE.
Original languageEnglish (US)
Title of host publication2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages4
ISBN (Print)9781467303248
StatePublished - Jan 2012

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01


Dive into the research topics of 'Mechanically flexible optically transparent porous mono-crystalline silicon substrate'. Together they form a unique fingerprint.

Cite this