Abstract
A unified creep-plasticity (UCP) model for predicting the failure behavior of solder interconnects has been developed using a mechanical property database at Northwestern University. The model uses data collected from the early stages of testing conducted under unaltered conditions to ensure that none of the failure mechanisms are affected. It has been used successfully in predicting the thermomechanical fatigue behavior of several classes of eutectic solders.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 15-23 |
| Number of pages | 9 |
| Journal | National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East) |
| Volume | 1 |
| State | Published - 1997 |
| Externally published | Yes |
| Event | Proceedings of the NEPCON WEST'97. Part 3 (of 3) - Anaheim, CA, USA Duration: Feb 23 1997 → Feb 27 1997 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering