Mechanical behavior of eutectic Sn-Ag and Sn-Zn solders

Hareesh Mavoori; Semyon Vaynman; Jason Chin; Brian Moran; Leon M. Keer; Morris E. Fine

doi:10.1557/proc-390-161

Mechanical behavior of eutectic Sn-Ag and Sn-Zn solders

Hareesh Mavoori^*, Semyon Vaynman, Jason Chin, Brian Moran, Leon M. Keer, Morris E. Fine

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

29 Scopus citations

Abstract

Eutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.

Original language	English (US)
Pages (from-to)	161-175
Number of pages	15
Journal	Materials Research Society Symposium - Proceedings
Volume	390
DOIs	https://doi.org/10.1557/proc-390-161
State	Published - 1995
Externally published	Yes
Event	Proceedings of the Spring Meeting on MRS - San Francisco, CA, USA Duration: Apr 17 1995 → Apr 20 1995

ASJC Scopus subject areas

Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
General Materials Science

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title = "Mechanical behavior of eutectic Sn-Ag and Sn-Zn solders",

abstract = "Eutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.",

author = "Hareesh Mavoori and Semyon Vaynman and Jason Chin and Brian Moran and Keer, {Leon M.} and Fine, {Morris E.}",

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AU - Mavoori, Hareesh

AU - Vaynman, Semyon

AU - Chin, Jason

AU - Moran, Brian

AU - Keer, Leon M.

AU - Fine, Morris E.

PY - 1995

Y1 - 1995

N2 - Eutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.

AB - Eutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.

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U2 - 10.1557/proc-390-161

DO - 10.1557/proc-390-161

M3 - Conference article

AN - SCOPUS:0029178912

SN - 0272-9172

VL - 390

SP - 161

EP - 175

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the Spring Meeting on MRS

Y2 - 17 April 1995 through 20 April 1995

ER -

Mechanical behavior of eutectic Sn-Ag and Sn-Zn solders

Abstract

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