Mechanical behavior of eutectic Sn-Ag and Sn-Zn solders

Hareesh Mavoori*, Semyon Vaynman, Jason Chin, Brian Moran, Leon M. Keer, Morris E. Fine

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

29 Scopus citations


Eutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.

Original languageEnglish (US)
Pages (from-to)161-175
Number of pages15
JournalMaterials Research Society Symposium - Proceedings
StatePublished - 1995
Externally publishedYes
EventProceedings of the Spring Meeting on MRS - San Francisco, CA, USA
Duration: Apr 17 1995Apr 20 1995

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • General Materials Science


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