Low Resistance Ohmic Contacts to Bi[sub 2]Te[sub 3] Using Ni and Co Metallization

Rahul P. Gupta, K. Xiong, J. B. White, Kyeongjae Cho, Husam N. Alshareef, B. E. Gnade

Research output: Contribution to journalArticlepeer-review

68 Scopus citations


A detailed study of the impact of surface preparation and postdeposition annealing on contact resistivity for sputtered Ni and Co contacts to thin-film Bi2 Te3 is presented. The specific contact resistivity is obtained using the transfer length method. It is observed that in situ sputter cleaning using Ar bombardment before metal deposition gives a surface free of oxides and other contaminants. This surface treatment reduces the contact resistivity by more than 10 times for both Ni and Co contacts. Postdeposition annealing at 100°C on samples that were sputter-cleaned further reduces the contact resistivity to < 10-7 cm2 for both Ni and Co contacts to Bi2 Te3. Co as a suitable contact metal to Bi2 Te3 is reported. Co provided similar contact resistance values as Ni, but had better adhesion and less diffusion into the thermoelectric material, making it a suitable candidate for contact metallization to Bi2 Te3 based devices. © 2010 The Electrochemical Society.
Original languageEnglish (US)
Pages (from-to)H666
JournalJournal of The Electrochemical Society
Issue number6
StatePublished - May 3 2010

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01

ASJC Scopus subject areas

  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Renewable Energy, Sustainability and the Environment


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