Learning from Global Sensitivity Analysis about identification of adhesion properties between an elastoplastic film and a rigid substrate

Xiaole Li, Gilles Lubineau

Research output: Contribution to journalArticlepeer-review


When peeling an elastoplastic film from rigid substrates, the work of separation (WOS) lumps the fracture energy of adhesion, i.e., the work of adhesion (WOA), and the dissipation from other sources, such as plastic deformation. This lumping poses a challenge for measuring the WOA of elastoplastic films to rigid substrates. A remedy would be to identify properties by matching numerical predictions with experimental measurements. Distinguishing the most informative metrics from the data produced by a peeling test is of initial significance in constructing the objective function to guarantee the efficiency and accuracy of that inverse identification. To evaluate the sensitivity of various experimental data/objective functions to the classical cohesive parameters characterizing adhesion, a model-based global sensitivity analysis is performed using Sobol’s approach. We combine a finite element model and a theoretical model to replicate the process of peeling an elastoplastic film under 90^0, including loading and unloading. The metrics, i.e., the plateau peeling force, the peeling arm profile, and the residual curvature after release are formulated as the cost functions and then are assessed. It is found that the peeling force, as a direct indicator of WOS, shows the most significant sensitivity to the fracture energy Gc , and the maximum curvature of the peeling arm is the most sensitive metric to the critical traction tc . Among the considered metrics to quantify the profile similarity of peeling arm, Fréchet distance is the most relevant for incorporation in the objective function for inverse identification purposes, considering sensitivity, accessibility, and tolerance to measurement error. The results also highlight the effect of film’s thickness on energy dissipation and on the sensitivity of metrics. For the peeling scenario with specified input properties, plastic dissipation increases with increasing film thickness, mainly because of the enhancement of the peeling film’s moment-bearing capacity. The increasing thickness enhances the sensitivity to Gc of peeling arm profile and the residual curvature while reducing their sensitivity to tc; minimal effect on peeling force is apparent. A tailored objective function incorporating the peeling force and the Fréchet distance is proposed, the effectiveness of which has been demonstrated by a FEMU identification of the adhesive properties between an annealed copper film and a rigid substrate.
Original languageEnglish (US)
Pages (from-to)111845
JournalInternational Journal of Solids and Structures
StatePublished - Jul 25 2022

ASJC Scopus subject areas

  • Mechanics of Materials
  • Modeling and Simulation
  • Materials Science(all)
  • Mechanical Engineering
  • Applied Mathematics
  • Condensed Matter Physics


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