Leakage mechanism in Cu damascene structure with methylsilane-doped low-k CVD oxide as intermetal dielectric

Zhen Cheng Wu*, Chiu Chih Chiang, Wei Hao Wu, Mao Chieh Chen, Shwang Ming Jeng, Lain Jong Li, Syun Ming Jang, Chen Hua Yu, Mong Song Liang

*Corresponding author for this work

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