Large-area plastic nanogap electronics enabled by adhesion lithography

James Semple, Dimitra G. Georgiadou, Gwenhivir Wyatt-Moon, Minho Yoon, Akmaral Seitkhan, Emre Yengel, Stephan Rossbauer, Francesca Bottacchi, Martyn A. McLachlan, Donal D. C. Bradley, Thomas D. Anthopoulos

Research output: Contribution to journalArticlepeer-review

29 Scopus citations


Large-area manufacturing of flexible nanoscale electronics has long been sought by the printed electronics industry. However, the lack of a robust, reliable, high throughput and low-cost technique that is capable of delivering high-performance functional devices has hitherto hindered commercial exploitation. Herein we report on the extensive range of capabilities presented by adhesion lithography (a-Lith), an innovative patterning technique for the fabrication of coplanar nanogap electrodes with arbitrarily large aspect ratio. We use this technique to fabricate a plethora of nanoscale electronic devices based on symmetric and asymmetric coplanar electrodes separated by a nanogap < 15 nm. We show that functional devices including self-aligned-gate transistors, radio frequency diodes and rectifying circuits, multi-colour organic light-emitting nanodiodes and multilevel non-volatile memory devices, can be fabricated in a facile manner with minimum process complexity on a range of substrates. The compatibility of the formed nanogap electrodes with a wide range of solution processable semiconductors and substrate materials renders a-Lith highly attractive for the manufacturing of large-area nanoscale opto/electronics on arbitrary size and shape substrates.
Original languageEnglish (US)
Journalnpj Flexible Electronics
Issue number1
StatePublished - Jun 25 2018

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: We acknowledge financial support from the European Union Horizon 2020 research and innovation programme, under the Marie Skłodowska-Curie grant agreement 706707, the Engineering and Physical Sciences Research Council (EPSRC) grant no. EP/G037515/1, and the EPSRC Centre for Innovative Manufacturing in Large Area Electronics (CIM-LAE) grant no. EP/K03099X/1. We also thank also Prof. Tobias Hertel for providing the PFO:(5, 7)CNT material used in this work. D.D.C.B. further thanks the University of Oxford for financial support.


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