Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs

Fahimullah Khan, Mohammad I. Younis

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


This paper presents for the first time implementation of zig–zag and solenoidal on-chip inductors in standard and cost effective SOI-MUMPs fabrication process. The solenoidal inductor offers high Q-factor and inductance as compared to planar zig–zag inductor. Bonding wires are used to construct the top conductor loop of the solenoidal inductor. The inductors are also characterized at elevated temperature for performance investigation in harsh environment. The mechanical resonance frequency of the inductors are characterized using the Finite element software COMSOL. The inductors are characterized using a vector network analyzer from 60 MHz to 3 GHz, and the results of both inductors are compared. The total size of the device is 2 × 0.7 mm2.
Original languageEnglish (US)
JournalAnalog Integrated Circuits and Signal Processing
StatePublished - Mar 10 2020

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: We acknowledge the financial support from King Abdullah University of Science and Technology (KAUST).


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