Investigating the impact of fill metal on crosstalk-induced delay and noise

Arthur Nieuwoudt, Jamil Kawa, Yehia Massoud

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations


In this paper, we investigate the crosstalk-induced delay and noise implications of floating and grounded fill metal generated using each of the rule-based and model-based fill placement techniques. We first examine the impact of fill metal on several interconnect test structures, which provide important insights into the performance and reliability implications of both intra-layer and inter-layer crosstalk coupling due to dummy fill. We then explore the noise and delay implications of fill metal on several large-scale designs implemented in 65 nm process technology. For the grounded fill cases, the fill metal significantly reduces crosstalk-induced delay and noise. Designs with floating fill also experience a reduction in average crosstalk-induced delay and noise, which is in contrast to the predictions of previous studies on small-scale interconnect structures. © 2008 IEEE.
Original languageEnglish (US)
Title of host publicationProceedings of the 9th International Symposium on Quality Electronic Design, ISQED 2008
Number of pages6
StatePublished - Aug 25 2008
Externally publishedYes

Bibliographical note

Generated from Scopus record by KAUST IRTS on 2022-09-13


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