TY - GEN
T1 - Investigating the design, performance, and reliability of multi-walled carbon nanotube interconnect
AU - Nieuwoudt, Arthur
AU - Massoud, Yehia
N1 - Generated from Scopus record by KAUST IRTS on 2022-09-13
PY - 2008/8/25
Y1 - 2008/8/25
N2 - In this paper, we develop a quantitative design technique for multi-walled carbon nanotube (MWCNT) based interconnect, which we utilize to examine the performance and reliability of future nanotube-based interconnect solutions. Leveraging an analytical RLC model for MWCNTs, we create the first closed-form formulation for the optimal nan-otube diameter and nanotube bundle height. The results indicate that the proposed design method decreases delay by 21% and 29% on average compared to non-optimized MWCNTs and single-walled carbon nanotube (SWCNT) bundles. We also find that large diameter MWCNT bundles are significantly more susceptible to process variations than SWCNT bundles, which will have important reliability implications in future nano-scale ICs. © 2008 IEEE.
AB - In this paper, we develop a quantitative design technique for multi-walled carbon nanotube (MWCNT) based interconnect, which we utilize to examine the performance and reliability of future nanotube-based interconnect solutions. Leveraging an analytical RLC model for MWCNTs, we create the first closed-form formulation for the optimal nan-otube diameter and nanotube bundle height. The results indicate that the proposed design method decreases delay by 21% and 29% on average compared to non-optimized MWCNTs and single-walled carbon nanotube (SWCNT) bundles. We also find that large diameter MWCNT bundles are significantly more susceptible to process variations than SWCNT bundles, which will have important reliability implications in future nano-scale ICs. © 2008 IEEE.
UR - http://ieeexplore.ieee.org/document/4479821/
UR - http://www.scopus.com/inward/record.url?scp=49749095673&partnerID=8YFLogxK
U2 - 10.1109/ISQED.2008.4479821
DO - 10.1109/ISQED.2008.4479821
M3 - Conference contribution
SN - 0769531172
SP - 691
EP - 696
BT - Proceedings of the 9th International Symposium on Quality Electronic Design, ISQED 2008
ER -