Interface characterization of nickel contacts to bulk bismuth tellurium selenide

O. D. Iyore; T. H. Lee; R. P. Gupta; J. B. White; H. N. Alshareef; M. J. Kim; B. E. Gnade

doi:10.1002/sia.3046

Interface characterization of nickel contacts to bulk bismuth tellurium selenide

O. D. Iyore, T. H. Lee, R. P. Gupta, J. B. White, H. N. Alshareef, M. J. Kim, B. E. Gnade

Research output: Contribution to journal › Article › peer-review

50 Scopus citations

Abstract

Transmission electron microscopy (TEM) characterization of nickel contacts to bulk bismuth tellurium selenide [Bi₂(Te, Se)₃] is reported. Samples were prepared in a dual column focused ion beam/scanning electron microscope (FIB/SEM) system using a lift-out technique, with ion beam energy and exposure times carefully optimized to minimize sample damage. Diffusion of Ni into Bi₂(Te, Se)₃ was observed and the formation of a nickel telluride (NiTe) interfacial region confirmed after heat treatment at 200 °C. Selected area diffraction patterns provided evidence of a modified bismuth telluride-like structure at the interface, identified by analytical electron microscopy to be composed of Ni and Bi₂(Te, Se)₃.

Original language	English (US)
Pages (from-to)	440-444
Number of pages	5
Journal	Surface and Interface Analysis
Volume	41
Issue number	5
DOIs	https://doi.org/10.1002/sia.3046
State	Published - May 2009
Externally published	Yes

Keywords

Electron energy loss spectroscopy
Focused ion beam
Thermoelectric materials
Transmission electron microscopy
X-ray diffraction

ASJC Scopus subject areas

General Chemistry
Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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10.1002/sia.3046

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title = "Interface characterization of nickel contacts to bulk bismuth tellurium selenide",

abstract = "Transmission electron microscopy (TEM) characterization of nickel contacts to bulk bismuth tellurium selenide [Bi2(Te, Se)3] is reported. Samples were prepared in a dual column focused ion beam/scanning electron microscope (FIB/SEM) system using a lift-out technique, with ion beam energy and exposure times carefully optimized to minimize sample damage. Diffusion of Ni into Bi2(Te, Se)3 was observed and the formation of a nickel telluride (NiTe) interfacial region confirmed after heat treatment at 200 °C. Selected area diffraction patterns provided evidence of a modified bismuth telluride-like structure at the interface, identified by analytical electron microscopy to be composed of Ni and Bi2(Te, Se)3.",

keywords = "Electron energy loss spectroscopy, Focused ion beam, Thermoelectric materials, Transmission electron microscopy, X-ray diffraction",

author = "Iyore, {O. D.} and Lee, {T. H.} and Gupta, {R. P.} and White, {J. B.} and Alshareef, {H. N.} and Kim, {M. J.} and Gnade, {B. E.}",

year = "2009",

month = may,

doi = "10.1002/sia.3046",

language = "English (US)",

volume = "41",

pages = "440--444",

journal = "Surface and Interface Analysis",

issn = "0142-2421",

publisher = "John Wiley and Sons Ltd",

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TY - JOUR

T1 - Interface characterization of nickel contacts to bulk bismuth tellurium selenide

AU - Iyore, O. D.

AU - Lee, T. H.

AU - Gupta, R. P.

AU - White, J. B.

AU - Alshareef, H. N.

AU - Kim, M. J.

AU - Gnade, B. E.

PY - 2009/5

Y1 - 2009/5

N2 - Transmission electron microscopy (TEM) characterization of nickel contacts to bulk bismuth tellurium selenide [Bi2(Te, Se)3] is reported. Samples were prepared in a dual column focused ion beam/scanning electron microscope (FIB/SEM) system using a lift-out technique, with ion beam energy and exposure times carefully optimized to minimize sample damage. Diffusion of Ni into Bi2(Te, Se)3 was observed and the formation of a nickel telluride (NiTe) interfacial region confirmed after heat treatment at 200 °C. Selected area diffraction patterns provided evidence of a modified bismuth telluride-like structure at the interface, identified by analytical electron microscopy to be composed of Ni and Bi2(Te, Se)3.

AB - Transmission electron microscopy (TEM) characterization of nickel contacts to bulk bismuth tellurium selenide [Bi2(Te, Se)3] is reported. Samples were prepared in a dual column focused ion beam/scanning electron microscope (FIB/SEM) system using a lift-out technique, with ion beam energy and exposure times carefully optimized to minimize sample damage. Diffusion of Ni into Bi2(Te, Se)3 was observed and the formation of a nickel telluride (NiTe) interfacial region confirmed after heat treatment at 200 °C. Selected area diffraction patterns provided evidence of a modified bismuth telluride-like structure at the interface, identified by analytical electron microscopy to be composed of Ni and Bi2(Te, Se)3.

KW - Electron energy loss spectroscopy

KW - Focused ion beam

KW - Thermoelectric materials

KW - Transmission electron microscopy

KW - X-ray diffraction

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U2 - 10.1002/sia.3046

DO - 10.1002/sia.3046

M3 - Article

AN - SCOPUS:67649195077

SN - 0142-2421

VL - 41

SP - 440

EP - 444

JO - Surface and Interface Analysis

JF - Surface and Interface Analysis

IS - 5

ER -

Interface characterization of nickel contacts to bulk bismuth tellurium selenide

Abstract

Keywords

ASJC Scopus subject areas

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