Interconnect analysis: From 3-D structures to circuit models

M. Kamon, N. Marques, Y. Massoud, L. Silveira, J. White

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

A combination of discretized integral formulations, sparsification techniques, and krylov-subspace based model-order reduction are described leading to robust tools for automatic generation of macromodels that represented the distributed RLC effects in 3-D interconnect. Three challenges are described based on these new method which include handling the non-ideal semiconductor substrate, picking the expansion points for model-order reduction, and handling the massively coupled problem. Computational results are presented to address the problems cited.
Original languageEnglish (US)
Pages (from-to)910-914
Number of pages5
JournalProceedings - Design Automation Conference
StatePublished - Jan 1 1999
Externally publishedYes

Fingerprint

Dive into the research topics of 'Interconnect analysis: From 3-D structures to circuit models'. Together they form a unique fingerprint.

Cite this