Abstract
We review several gate stack fabrication issues critical for robust, commercially viable tools, including assessment of possible fab contamination due to the higher-k gate dielectrics and the role of subsequent thermal procedures during, for example, source/drain anneals (including the importance of the oxygen partial pressure) to ensure their compatibility with conventional planar polysilicon CMOS transistor fabrication processes.
Original language | English (US) |
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Title of host publication | Extended Abstracts of International Workshop on Gate Insulator, IWGI 2001 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 2-11 |
Number of pages | 10 |
ISBN (Electronic) | 4891140216, 9784891140212 |
DOIs | |
State | Published - 2001 |
Event | International Workshop on Gate Insulator, IWGI 2001 - Tokyo, Japan Duration: Nov 1 2001 → Nov 2 2001 |
Publication series
Name | Extended Abstracts of International Workshop on Gate Insulator, IWGI 2001 |
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Conference
Conference | International Workshop on Gate Insulator, IWGI 2001 |
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Country/Territory | Japan |
City | Tokyo |
Period | 11/1/01 → 11/2/01 |
Bibliographical note
Publisher Copyright:© 2001 Japan Soc of Applied Physics.
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials