Many groups in academia are having problems patterning interconnections to small electrodes using wire bonding, including metal melting and detachment of previously bonded wires. It is a fact that the industry makes reliable wire bonding using automatic setups and expert personnel, and also that many groups in academia can do wire bonding reliably. However, it is also true that wire bonding is much more problematic than other techniques often employed to pattern interconnections, such as lithography or inkjet printing. In this article, the contact resistance and maximum currents driven by metallic interconnections patterned via wire bonding, lithography, and inkjet printing are compared. It is concluded that interconnections patterned via inkjet printing meet the requirements of many types of experiments, and that inkjet printing is a very cheap and easy-to-use alternative to wire bonding, especially attractive for academics.
Bibliographical noteKAUST Repository Item: Exported on 2021-12-30
Acknowledgements: This work was supported by the Baseline funding scheme of the King Abdullah University of Science and Technology, the Ministry of Science and Technology of China (grant nos. 2018YFE0100800, 2019YFE0124200), the National Natural Science Foundation of China (grant no. 61874075), the Suzhou Science and Technology Bureau, the Ministry of Finance of China (grant no. SX21400213), the 111 Project from the State Administration of Foreign Experts Affairs of China, the Collaborative Innovation Centre of Suzhou Nano Science & Technology, the Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, the Priority Academic Program Development of Jiangsu Higher Education Institutions, and a Technion-Guangdong Fellowship.
ASJC Scopus subject areas
- General Materials Science
- General Chemistry
- Condensed Matter Physics